(module PIC_ICSP_MINI_5_PIN (layer F.Cu) (tedit 5963E9B0)
  (descr "MINI ICSP CONNECTOR - 5 PIN")
  (tags "MINI ICSP CONNECTOR - 5 PIN")
  (attr virtual)
  (fp_text reference Ref** (at -3.048 -1.524) (layer F.SilkS)
    (effects (font (size 0.6096 0.6096) (thickness 0.127)))
  )
  (fp_text value Val** (at -3.048 1.27) (layer F.SilkS)
    (effects (font (size 0.6096 0.6096) (thickness 0.127)))
  )
  (fp_line (start -3.99796 -0.99822) (end -3.99796 0.99822) (layer Dwgs.User) (width 0.2032))
  (fp_line (start -3.99796 0.99822) (end 3.99796 0.99822) (layer Dwgs.User) (width 0.2032))
  (fp_line (start 3.99796 0.99822) (end 3.99796 -0.99822) (layer Dwgs.User) (width 0.2032))
  (fp_line (start 3.99796 -0.99822) (end -3.99796 -0.99822) (layer Dwgs.User) (width 0.2032))
  (fp_line (start -2.39776 -0.99822) (end -3.59918 -0.99822) (layer F.SilkS) (width 0.2032))
  (fp_line (start -3.5941 -0.99822) (end -2.39268 -0.99822) (layer F.SilkS) (width 0.2032))
  (pad 1 thru_hole circle (at -2.99974 0) (size 1.2065 1.2065) (drill 0.6985) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 2 thru_hole circle (at -1.4986 0) (size 1.2065 1.2065) (drill 0.6985) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 3 thru_hole circle (at 0 0) (size 1.2065 1.2065) (drill 0.6985) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 4 thru_hole circle (at 1.4986 0) (size 1.2065 1.2065) (drill 0.6985) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 5 thru_hole circle (at 2.99974 0) (size 1.2065 1.2065) (drill 0.6985) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
)
