(module MICROFET_2X2 (layer F.Cu) (tedit 200000)
  (descr "1206-8 CHIPFET")
  (tags "1206-8 CHIPFET")
  (attr smd)
  (fp_text reference >NAME (at -1.4478 0 90) (layer F.SilkS)
    (effects (font (size 0.6096 0.6096) (thickness 0.127)))
  )
  (fp_text value >VALUE (at 1.778 0 90) (layer F.SilkS)
    (effects (font (size 0.6096 0.6096) (thickness 0.127)))
  )
  (fp_line (start -0.99822 -0.99822) (end 0.99822 -0.99822) (layer Dwgs.User) (width 0.127))
  (fp_line (start 0.99822 -0.99822) (end 0.99822 0.99822) (layer Dwgs.User) (width 0.127))
  (fp_line (start 0.99822 0.99822) (end -0.99822 0.99822) (layer Dwgs.User) (width 0.127))
  (fp_line (start -0.99822 0.99822) (end -0.99822 -0.99822) (layer Dwgs.User) (width 0.127))
  (fp_circle (center 1.143 -1.27) (end 1.143 -1.3716) (layer F.SilkS) (width 0.1778))
  (pad D1 smd rect (at 0.49784 0) (size 0.79756 0.99822) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad D1_2 smd rect (at 0.6477 0.9144) (size 0.4191 0.4191) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad D2 smd rect (at -0.49784 0) (size 0.79756 0.99822) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad D2_2 smd rect (at -0.6477 -0.9144) (size 0.4191 0.4191) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad G1 smd rect (at 0 -0.9144) (size 0.4191 0.4191) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad G2 smd rect (at 0 0.9144) (size 0.4191 0.4191) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad S1 smd rect (at 0.6477 -0.9144) (size 0.4191 0.4191) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
  (pad S2 smd rect (at -0.6477 0.9144) (size 0.4191 0.4191) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016))
)
